PCB Kits
MOQ: 1 Pieces
Delivery time: 7 Day
Process:Adopting the classic green soldermask process
Material Composition:The substrate is made of fiberglass reinforced epoxy resin (FR-4) and covered with precision-etched copper foil circuitry to form a multi-layer signal transmission network.
Function: It can realize data acquisition, signal conversion and peripheral driver etc.
Technical details: Equipped with SMD chip components (including resistor R2, capacitor C3 and other marking devices)
Characteristic marking: Adopting surface mount technology (SMT) process
Product Details
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